{"id":2370,"date":"2024-07-25T18:32:47","date_gmt":"2024-07-25T10:32:47","guid":{"rendered":"https:\/\/taichungbro.com\/?p=2370"},"modified":"2026-10-22T01:09:41","modified_gmt":"2026-10-21T17:09:41","slug":"high-temperature-plastic","status":"publish","type":"post","link":"https:\/\/www.taichungbro.com\/en\/2024\/07\/25\/high-temperature-plastic\/","title":{"rendered":"King of Plastics: Temperature Limits, Continuous Service Temperatures, and Selection Guide for 6 Types of High and Low Temperature Resistant Plastic Materials"},"content":{"rendered":"<p>In semiconductor plasma processes, aerospace cryogenic fuel delivery, electronic lead-free reflow ovens, and highly corrosive chemical pipelines, traditional metal materials often face bottlenecks such as corrosion, excessive weight, or insulation failure; general-purpose plastics (such as PE, PP, and PVC) soften and deform at temperatures exceeding 80\u00b0C to 100\u00b0C, or become brittle at sub-zero temperatures. To overcome the operational limitations of extreme conditions, special engineering plastics with extreme heat resistance, low-temperature toughness, and dimensional stability have emerged.<\/p>\n<p>However, the most common intuitive mistake many organizations and materials engineers make when selecting materials is &quot;choosing materials solely based on their melting point ($T_m$).&quot; A polymer material with a melting point exceeding 300\u00b0C as specified in the datasheet may already undergo significant latent softening at 150\u00b0C and under a bending load of 1.82 MPa, leading to structural failure. Under extreme temperature conditions, what truly determines the lifespan of a component is the material itself.<strong>Continuous operating temperature (UL 746B Relative Temperature Index RTI)<\/strong>\u3001<strong>Load-induced heat distortion temperature (HDT)<\/strong>\u8207<strong>Low-temperature glass transition temperature ($T_g$)<\/strong>.<\/p>\n<p>Among the six most critical high and low temperature resistant materials in industrial settings:<\/p>\n<ul>\n<li><strong>FR4 and CDM synthetic stone<\/strong>Based on glass fiber reinforced epoxy or special high-temperature resistant resin, it is the cost-effective pillar for electronic circuit boards and SMT reflow fixtures (short-term temperature resistance of 260\u00b0C\uff5e300\u00b0C).<\/li>\n<li><strong>PTFE (polytetrafluoroethylene)<\/strong>With a wide temperature range from -200\u00b0C to 260\u00b0C, it possesses unparalleled self-lubricating, dielectric, and chemically inert properties, setting a benchmark for low-temperature, low-loss performance.<\/li>\n<li><strong>PEEK (Polyetheretherketone)<\/strong>It retains excellent tensile and bending strength even at continuous high temperatures of 250\u00b0C, making it the preferred choice for high-strength machinery to replace aluminum alloys and stainless steel.<\/li>\n<li><strong>PI (polyimide) and PBI (polybenzimidazole)<\/strong>It ranks at the top of the polymer temperature resistance pyramid, can serve for a long time above 300\u00b0C, and even maintains structural integrity under instantaneous high temperatures of 400\u00b0C to 500\u00b0C. It is specially designed for semiconductor wafer carriers and aerospace heat shields.<\/li>\n<\/ul>\n<p>This article will provide a complete breakdown of the temperature boundaries, mechanical characteristics, and practical selection comparisons of these six types of high and low temperature resistant plastics, helping engineers to accurately identify the most suitable material solution.<\/p>\n<nav class=\"article-toc\" aria-labelledby=\"article-toc-heading\" style=\"margin-block: 1.5em;\">\n<h2 id=\"article-toc-heading\">Table of Contents<\/h2>\n<ol>\n<li><a href=\"#temperature-metrics-rti-hdt-tg\" style=\"color: #00c8d7; text-decoration: underline;\">Temperature resistance is not the same as melting point: Understanding RTI, HDT, and Tg is the first step in engineering selection.<\/a><\/li>\n<li><a href=\"#six-high-temp-plastics-matrix\" style=\"color: #00c8d7; text-decoration: underline;\">Comparison table of 6 high and low temperature resistant plastic specifications: temperature limit, low temperature boundary and mechanical strength<\/a><\/li>\n<li><a href=\"#fr4-and-cdm-composite-stone\" style=\"color: #00c8d7; text-decoration: underline;\">FR4 and CDM synthetic stone: the cost-effective pillars of electronic manufacturing processes and high-temperature reflow fixtures<\/a><\/li>\n<li><a href=\"#ptfe-fluoropolymer-cryogenic\" style=\"color: #00c8d7; text-decoration: underline;\">PTFE (Teflon): The king of low friction, withstanding temperatures as low as -200\u00b0C, deep cooling, and superior chemical resistance.<\/a><\/li>\n<li><a href=\"#peek-engineering-plastic-metal-replacement\" style=\"color: #00c8d7; text-decoration: underline;\">PEEK (Polyetheretherketone): A metal alternative that combines continuous temperature resistance up to 250\u00b0C with ultra-high mechanical rigidity.<\/a><\/li>\n<li><a href=\"#pi-and-pbi-pyramid-peak\" style=\"color: #00c8d7; text-decoration: underline;\">PI (polyimide) and PBI (polybenzimidazole): The pinnacle of the plastics pyramid facing extreme environments of 300\u00b0C to 500\u00b0C.<\/a><\/li>\n<li><a href=\"#selection-decision-framework\" style=\"color: #00c8d7; text-decoration: underline;\">Temperature resistance selection depends on load and environment: a three-dimensional decision-making method based on temperature, stress, and chemical medium.<\/a><\/li>\n<\/ol>\n<\/nav>\n<h2 id=\"temperature-metrics-rti-hdt-tg\">Temperature resistance is not the same as melting point: Understanding RTI, HDT, and Tg is the first step in engineering selection.<\/h2>\n<p>When evaluating the performance of polymer materials at extreme temperatures, three key physical parameters that are often confused must be clarified:<\/p>\n<ul>\n<li><strong>Glass transition temperature ($T_g$)<\/strong>The transition temperature is the temperature at which amorphous polymer chains change from a frozen &quot;glassy state&quot; to a mobile &quot;elastic state&quot;. Once this temperature is exceeded, the elastic modulus of amorphous polymers will drop drastically by 2 to 3 orders of magnitude; although semi-crystalline polymers still have crystalline regions to maintain the framework, their rigidity will also decrease significantly.<\/li>\n<li><strong>Heat Deflection Temperature (HDT, according to ASTM D648)<\/strong>HDT is the temperature at which a test bar is heated to produce a deflection of 0.25 mm under a specific three-point bending load (typically 0.45 MPa or standard high pressure 1.82 MPa). HDT reflects the &quot;softening limit under stress in the short term&quot; and is closer to the actual assembly conditions than the pure melting point without load.<\/li>\n<li><strong>Relative Temperature Index (RTI, according to UL 746B) for continuous long-term use<\/strong>This refers to the highest ambient temperature at which a material retains its key properties (such as electrical insulation strength, impact strength, or tensile strength) above 50% after being exposed to this temperature for 100,000 hours (approximately 11.4 years). This is the authoritative basis for assessing the long-term safe life of equipment parts.<\/li>\n<\/ul>\n<p>in short:<strong>For short-term operation without load, observe the melting point and thermal decomposition temperature; for short-term operation under load, observe the HDT; for long-term operation, observe the UL RTI; and for sub-zero temperatures, observe the low-temperature embrittlement transition point.<\/strong>If the stress under operating conditions is not taken into account and high melting point materials are blindly selected, parts may jam or break under continuous heating.<\/p>\n<h2 id=\"six-high-temp-plastics-matrix\">Comparison table of 6 high and low temperature resistant plastic specifications: temperature limit, low temperature boundary and mechanical strength<\/h2>\n<p>Based on ASTM, UL, and standard specification manuals from major material manufacturers (DuPont, Victrex, Ensinger, R\u00f6chling), the following is a compilation of six key physical properties of mainstream high and low temperature resistant plastics and composite materials:<\/p>\n<figure class=\"wp-block-table\">\n<table>\n<thead>\n<tr>\n<th>Material Name<\/th>\n<th>Continuous operating temperature (RTI \u00b0C)<\/th>\n<th>Short-term extreme temperature resistance (\u00b0C)<\/th>\n<th>Extremely low temperature operating limit (\u00b0C)<\/th>\n<th>Core mechanical characteristics and working condition positioning<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>FR4 (glass fiber reinforced epoxy resin)<\/td>\n<td>130 ~ 140<\/td>\n<td>180 ~ 200<\/td>\n<td>-40<\/td>\n<td>High rigidity and excellent insulation; suitable for electronic substrates and low-cost room-temperature fixtures.<\/td>\n<\/tr>\n<tr>\n<td>CDM Synthetic Stone (Nano Composite Stone)<\/td>\n<td>260 ~ 280<\/td>\n<td>300 ~ 350<\/td>\n<td>-20<\/td>\n<td>Dimensionally thermally stable, resistant to solder pot shock, reflow soldering and wave soldering carrier<\/td>\n<\/tr>\n<tr>\n<td>PTFE (polytetrafluoroethylene)<\/td>\n<td>260<\/td>\n<td>280 ~ 300<\/td>\n<td>-200 ~ -269<\/td>\n<td>It possesses extremely high toughness at sub-zero temperatures, an extremely low coefficient of friction, and excellent chemical resistance, but is also resistant to pressure differences.<\/td>\n<\/tr>\n<tr>\n<td>PEEK (Polyetheretherketone)<\/td>\n<td>250 ~ 260<\/td>\n<td>300 ~ 310<\/td>\n<td>-60<\/td>\n<td>High tensile modulus, fatigue resistance, wear resistance, heavy-duty machinery and semiconductor parts<\/td>\n<\/tr>\n<tr>\n<td>PI (polyimide)<\/td>\n<td>260 ~ 300<\/td>\n<td>400 ~ 480<\/td>\n<td>-200 ~ -269<\/td>\n<td>Wide-range temperature resistance, radiation resistance, self-lubricating and wear-resistant, aerospace and high-end wafer vacuum chuck<\/td>\n<\/tr>\n<tr>\n<td>PBI (polybenzimidazole)<\/td>\n<td>310 ~ 340<\/td>\n<td>450 ~ 500<\/td>\n<td>-150<\/td>\n<td>Highest temperature resistance and compressive strength (400 MPa) of plastic, extreme high temperature insulated valve<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/figure>\n<p><strong>Table Selection Judgment and Practical Critical Points:<\/strong> The comparison table shows that if the operating conditions involve &quot;sub-zero temperatures (such as liquid nitrogen transport at -196\u00b0C),&quot; PTFE and certain PI materials (such as Kapton) are the only two materials that can maintain bending flexibility without becoming brittle at near absolute zero. If the operating conditions involve &quot;short-term high-temperature shock (such as lead-free soldering at 260\u00b0C for 10-30 seconds),&quot; CDM synthetic stone becomes the best carrier due to its extremely low thermal expansion rate and thermal shock resistance. If the system is at &quot;above 200\u00b0C and needs to withstand continuous high torque or high abrasion contact,&quot; pure PTFE will be unsuitable due to cold creep, and it is necessary to switch to PEEK or PI reinforced with graphite\/carbon fiber (such as Vespel).<\/p>\n<h2 id=\"fr4-and-cdm-composite-stone\">FR4 and CDM synthetic stone: the cost-effective pillars of electronic manufacturing processes and high-temperature reflow fixtures<\/h2>\n<h3>1. FR4 (Glass Fiber Reinforced Epoxy Laminate)<\/h3>\n<p>FR4 is a thermosetting composite material made by hot pressing electronic-grade alkali-free glass fiber cloth impregnated with flame-retardant epoxy resin.<\/p>\n<ul>\n<li><strong>Temperature resistance grading<\/strong>The glass transition temperature (GTH) of standard FR4 is approximately 130\u00b0C to 140\u00b0C; while that of high-end FR4 can reach 170\u00b0C to 180\u00b0C. Its continuous operating temperature is generally specified to be around 130\u00b0C.<\/li>\n<li><strong>Advantages, disadvantages and limitations<\/strong>It possesses excellent electrical insulation, high bending strength, and excellent processing economy. However, prolonged heating at temperatures exceeding 180\u00b0C will cause the epoxy resin backbone to rapidly oxidize and yellow, resulting in delamination and blistering. If directly subjected to repeated cycles in a 260\u00b0C lead-free solder bath, the board is prone to permanent warping. Therefore, FR4 is primarily used as a printed circuit board substrate or low-temperature testing fixture, and is unsuitable for long-term, heavy-duty, high-temperature dynamic mechanisms.<\/li>\n<\/ul>\n<h3>2. CDM (Chemical Stone\/Composite Stone\/Nano Composite Material Board)<\/h3>\n<p>CDM (such as Durostone and Ricocel) is specifically designed to address the high-temperature thermal stress in surface mount technology (SMT) and wave soldering. It is made by high-temperature heat-resistant unsaturated polyester resin or vinyl ester resin, combined with extremely fine glass fiber mat and nano-ceramic fillers, and cured under high pressure.<\/p>\n<ul>\n<li><strong>Operating characteristics<\/strong>Under the impact of liquid solder at 260\u00b0C to 300\u00b0C, CDM can maintain extremely high mechanical flatness, extremely low thermal conductivity (which can protect the heat-sensitive components on the board surface), and is resistant to chemical corrosion by solder flux.<\/li>\n<li><strong>Surface antistatic design<\/strong>High-grade synthetic stone slabs possess uniform anti-static (ESD) properties with a volume impedance of $10^6 sim 10^9 , Omega$, preventing precision IC components from being damaged by static electricity during rapid handling. In modern electronic assembly lines, CDM is an irreplaceable high-temperature cyclic jig material.<\/li>\n<\/ul>\n<h2 id=\"ptfe-fluoropolymer-cryogenic\">PTFE (Teflon): The king of low friction, withstanding temperatures as low as -200\u00b0C, deep cooling, and superior chemical resistance.<\/h2>\n<p>Polytetrafluoroethylene (PTFE) has a carbon chain backbone, with the exterior covered by a tightly stacked helix of fluorine atoms. The strong C\u2013F chemical bonds give it near-perfect chemical inertness and a nonpolar surface.<\/p>\n<h3>1. Continuous performance at extreme low and high temperatures<\/h3>\n<p>PTFE has a melting point as high as 327\u00b0C and a continuous operating temperature (UL RTI) of 260\u00b0C. But what&#039;s even more amazing is its...<strong>Low temperature toughness<\/strong>In cryogenic environments such as liquid nitrogen (-196\u00b0C) or even liquid helium (-269\u00b0C), the molecular chains inside most plastics are frozen into brittle glass, which shatters upon the slightest impact. However, the molecular bonds of PTFE retain their microscopic slip capability even at -200\u00b0C, and its notched impact strength can still be maintained above 100 J\/m. This makes it the only evergreen choice for sealing gaskets in superconducting cryogenic valves and liquefied natural gas (LNG) transfer pumps.<\/p>\n<h3>2. Engineering limitations: Cold flow creep and high-frequency electrical applications<\/h3>\n<p>The fatal flaw of pure PTFE is that<strong>Poor compressive strength and &quot;cold flow&quot; (Cold Flow \/ Creep)<\/strong>Under continuous loads at both room temperature and high temperatures, the material will flow slowly laterally like a highly viscous liquid, leading to loss of flange bolt preload and leakage. Therefore, heavy-duty seals typically require modified PTFE with added glass fiber, carbon fiber, or bronze powder, or a specific metal cladding structure. For achieving highly reliable seals under extreme temperatures and chemical fluid conditions, further comparison with other products is recommended.<a href=\"https:\/\/www.taichungbro.com\/en\/2025\/07\/04\/ffkm\/\" style=\"color: #00c8d7; text-decoration: underline;\">Analysis of the sealing properties and chemical resistance limits of perfluoroether rubber FFKM<\/a>and<a href=\"https:\/\/www.taichungbro.com\/en\/2025\/09\/02\/o-ring\/\" style=\"color: #00c8d7; text-decoration: underline;\">O-ring specifications, dimensions, compression ratio, and temperature resistance selection guide<\/a>Geometric design principles.<\/p>\n<p>It is worth noting that PTFE has extremely low dielectric constant ($D_k \u2248 2.1$) and dielectric loss ($D_f \u2248 0.001$). In high-frequency, high-speed communication and AI server transmission architectures, PTFE films have already entered the field of next-generation substrates. To understand the processing trade-offs between PTFE and liquid crystal polymers (LCP) in high-frequency transmission, please read further.<a href=\"https:\/\/www.taichungbro.com\/en\/2026\/10\/22\/ptfe-vs-lcp-fpc-substrate\/\" style=\"color: #00c8d7; text-decoration: underline;\">PTFE vs. LCP High-Frequency Flexible Circuit Board Substrate Selection Comparison Table<\/a>.<\/p>\n<h2 id=\"peek-engineering-plastic-metal-replacement\">PEEK (Polyetheretherketone): A metal alternative that combines continuous temperature resistance up to 250\u00b0C with ultra-high mechanical rigidity.<\/h2>\n<p>Polyetheretherketone (PEEK) is a representative of aromatic semi-crystalline thermoplastic polymers and one of the engineering plastics with the strongest comprehensive mechanical properties in the industry.<\/p>\n<h3>1. High mechanical strength retention at 250\u00b0C<\/h3>\n<p>Pure PEEK (such as Victrex 450G) has a melting point of 343\u00b0C, a continuous operating temperature of 250\u00b0C\u2013260\u00b0C, and short-term heat resistance up to 300\u00b0C. Compared to PTFE, PEEK&#039;s most critical advantage is...<strong>High mechanical rigidity and resistance to creep<\/strong>\uff1a<\/p>\n<ul>\n<li>At room temperature, pure PEEK has a tensile strength of up to 100 MPa. After adding 30% carbon fiber reinforcement (PEEK-CA30), the tensile strength can soar to over 200 MPa, approaching the level of aluminum alloy.<\/li>\n<li>Even at high temperatures up to 200\u00b0C, carbon fiber reinforced PEEK can still retain room temperature stiffness of over 60%, and its high-temperature compressive strength far exceeds that of other thermoplastic materials.<\/li>\n<\/ul>\n<h3>2. Application scenarios and resistance to special environments<\/h3>\n<ul>\n<li><strong>Resistant to repeated high-pressure steam sterilization<\/strong>PEEK is widely used in medical surgical instruments and implants because it can withstand more than 1,000 cycles of high-pressure, high-temperature steam sterilization at 134\u00b0C without hydrolytic degradation.<\/li>\n<li><strong>Semiconductor wafer transport (CMP \/ wafer grippers)<\/strong>PEEK does not release particulate impurities under the scouring of strong acids, alkalis and abrasive fluids, and has excellent wear resistance.<\/li>\n<li><strong>Radiation resistance and chemical resistance<\/strong>PEEK exhibits excellent performance in nuclear power generation equipment and aerospace hydraulic valves. It also demonstrates excellent coolant compatibility in submerged cooling systems; relevant fluid chemistry properties can be found in [reference needed].<a href=\"https:\/\/www.taichungbro.com\/en\/2026\/07\/30\/fluorocarbon-immersion-cooling-pfas\/\" style=\"color: #00c8d7; text-decoration: underline;\">Compatibility analysis of fluorocarbon coolant and immersion cooling materials<\/a>.<\/li>\n<\/ul>\n<p><strong>Project Precautions<\/strong>The glass transition temperature (TTH) of pure PEEK is only about 143\u00b0C. When the operating temperature exceeds 143\u00b0C, the stiffness of pure PEEK experiences a rapid decrease; therefore, if the operating temperature is between 150\u00b0C and 250\u00b0C and subjected to high loads,<strong>Specifications containing 30% glass fiber (GF30) or carbon fiber (CF30) must be selected.<\/strong>This ensures that the structure maintains a high heat distortion temperature (HDT up to 315\u00b0C) even when the temperature is higher than $T_g$.<\/p>\n<h2 id=\"pi-and-pbi-pyramid-peak\">PI (polyimide) and PBI (polybenzimidazole): The pinnacle of the plastics pyramid facing extreme environments of 300\u00b0C to 500\u00b0C.<\/h2>\n<p>When the operating temperature exceeds 260\u00b0C, even PEEK begins to approach the softening boundary, only polyimide (PI) and polybenzimidazole (PBI) can remain at the forefront of high temperature.<\/p>\n<h3>1. PI (Polyimide, representative products: DuPont Vespel\u00ae \/ Kapton\u00ae)<\/h3>\n<p>PI has an extremely rigid aromatic ring and amide-imine heterocyclic structure, and is a typical high-heat-resistant thermosetting or highly crystalline polymer.<\/p>\n<ul>\n<li><strong>Wide temperature range<\/strong>Kapton in thin film form can maintain physical flexibility in a wide temperature range of -269\u00b0C to +400\u00b0C; Vespel SP-1 sheets and rods, which are hot-pressed with high density, have a continuous operating temperature of up to 288\u00b0C and can withstand short-term instantaneous baking at 480\u00b0C.<\/li>\n<li><strong>No melting point and self-lubricating properties<\/strong>Vespel does not melt or flow at high temperatures, and its thermal decomposition temperature exceeds 500\u00b0C. Grades with added graphite or PTFE (such as Vespel SP-21) exhibit extremely low coefficients of friction and wear rates in unlubricated vacuum environments, and are widely used in wafer clamping rings for semiconductor plasma etching machines, thrust reverser bearings for jet engines, and turbine blade sealing rings.<\/li>\n<\/ul>\n<h3>2. PBI (Polybenzimidazole, representative product: Celazole\u00ae PBI)<\/h3>\n<p>PBI is currently the commercially available linear thermoplastic with the highest temperature resistance limit.<\/p>\n<ul>\n<li><strong>The peak of the polymer pyramid<\/strong>Continuous operating temperature up to <strong>310\u00b0C\uff5e340\u00b0C<\/strong>The short-term heat resistance limit is even higher. <strong>500\u00b0C<\/strong> The above. Its heat distortion temperature (HDT at 1.82 MPa) reaches 435\u00b0C.<\/li>\n<li><strong>Unparalleled high-temperature hardness and compressive strength<\/strong>At room temperature, PBI has a compressive strength of up to 400 MPa and a Rockwell hardness of M125, making it the hardest and most abrasion-resistant of all unreinforced engineering plastics. Even at 300\u00b0C, PBI&#039;s flexural strength and modulus are still higher than those of most engineering plastics at room temperature.<\/li>\n<li><strong>Applications and Challenges<\/strong>Primarily used in extremely demanding applications, such as insulating components for semiconductor ion implanters, contact pads between glass and can molds, and high-temperature, high-pressure oil valve seats. However, PBI raw materials are expensive, extremely brittle during processing, and slightly hygroscopic (it needs to be slowly dried after absorbing moisture to prevent vaporization and bubbling when heated). It is typically used only as a last resort when other materials have failed.<\/li>\n<\/ul>\n<h2 id=\"selection-decision-framework\">Temperature resistance selection depends on load and environment: a three-dimensional decision-making method based on temperature, stress, and chemical medium.<\/h2>\n<p>In engineering material selection, there is no &quot;best material,&quot; only the &quot;most compatible compromise under specific budget and operating conditions.&quot; When faced with the selection of high and low temperature resistant plastics, engineers can quickly converge on the following decision matrix based on the operating temperature range, mechanical load, and environmental medium:<\/p>\n<figure class=\"wp-block-table\">\n<table>\n<thead>\n<tr>\n<th>Operating temperature and conditions<\/th>\n<th>Core Physics Challenge<\/th>\n<th>Recommended first choice material<\/th>\n<th>Secondary alternatives\/modification options<\/th>\n<th>Typical engineering application scenarios<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Extremely low temperature cryogenic (-60\u00b0C to -269\u00b0C)<\/td>\n<td>Preventing low-temperature brittleness, maintaining sealing elasticity, and liquid nitrogen\/liquid helium wetting.<\/td>\n<td>PTFE (Teflon)<\/td>\n<td>PI (Kapton polyimide film)<\/td>\n<td>Cryogenic valve sealing gaskets, LNG cryogenic pumps, aerospace and deep space thermal control<\/td>\n<\/tr>\n<tr>\n<td>Medium-temperature electrical isolation (130\u00b0C ~ 180\u00b0C)<\/td>\n<td>Electrical insulation strength, heat resistance to yellowing, and processing cost-effectiveness<\/td>\n<td>High Tg FR4<\/td>\n<td>Standard FR4 (continuous &lt;130\u00b0C)<\/td>\n<td>Industrial control circuit boards, ambient temperature electrical insulation boards, electronic test fixtures<\/td>\n<\/tr>\n<tr>\n<td>Short-duration high-temperature furnace treatment (260\u00b0C ~ 350\u00b0C)<\/td>\n<td>Withstands thermal shock from lead-free solder baths, resists high-temperature warping, and is anti-static.<\/td>\n<td>CDM Synthetic Stone<\/td>\n<td>Nanocomposite stones (such as Ricocel)<\/td>\n<td>SMT lead-free reflow soldering carrier, wave soldering reflow tray<\/td>\n<\/tr>\n<tr>\n<td>Continuous heavy-duty machinery (200\u00b0C ~ 260\u00b0C)<\/td>\n<td>High tensile rigidity, long fatigue life, and resistance to hydrolysis and wear.<\/td>\n<td>PEEK-CF30 (Carbon Fiber Reinforced)<\/td>\n<td>PEEK-GF30 (glass fiber reinforced)<\/td>\n<td>Metal replacement gears, semiconductor wafer grippers, high-pressure wear-resistant rings<\/td>\n<\/tr>\n<tr>\n<td>Extreme high temperature limit (280\u00b0C ~ 500\u00b0C)<\/td>\n<td>It does not melt at extremely high temperatures and has an exceptionally high compressive strength (400 MPa).<\/td>\n<td>PBI (Celazole)<\/td>\n<td>PI (Vespel abrasion-resistant grade)<\/td>\n<td>Plasma etching wafer focusing ring, aerospace heat-resistant valve seat, glass mold gasket<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/figure>\n<p>When implementing actual projects, it is recommended to complete the following three selection steps in sequence:<\/p>\n<ul>\n<li><strong>First hurdle: Clarifying temperature limits and exposure time (continuous RTI vs. instantaneous thermal shock)<\/strong>If the operating conditions involve sub-zero temperatures (-100\u00b0C to -269\u00b0C), exclude most rigid plastics and prioritize PTFE or PI films; if it involves short-term high-temperature impact of 10 to 30 seconds (260\u00b0C to 300\u00b0C), CDM synthetic stone or high Tg FR4 is preferred; if long-term operation at 200\u00b0C to 250\u00b0C is required, PEEK is the core candidate; above 260\u00b0C, PI or PBI must be considered.<\/li>\n<li><strong>The second step: Examine the mechanical load and potential risks (select PTFE for no load, and select reinforced PEEK for heavy load).<\/strong>If the parts are subjected to high shear, frictional torque or alternating impact, avoid using pure PTFE which is prone to cooling; instead, choose reinforced PEEK with added carbon fiber or glass fiber. If the working conditions require extremely high compressive strength and high-temperature dimensional tolerances (such as precision wafer fixtures), PBI and Vespel PI have overwhelming rigidity.<\/li>\n<li><strong>The third step: Verify the chemical corrosion resistance and overall BOM cost (to prevent over-design).<\/strong>In high-temperature, highly corrosive acid and alkali environments, PTFE has the broadest chemical resistance spectrum and its cost is significantly lower than that of PEEK and PBI. PBI and Vespel have extremely high unit prices, and over-design should be avoided unless absolutely necessary. In general industrial insulation and support parts from room temperature to 140\u00b0C, FR4 remains the most pragmatic foundation that balances strength and cost.<\/li>\n<\/ul>\n<p>By clarifying these three boundaries, engineers can shift from blindly chasing the highest temperature figures in the specifications to proactively controlling the thermomechanical behavior of materials under real loads.<\/p>","protected":false},"excerpt":{"rendered":"<p>\u8010\u9ad8\u4f4e\u6eab\u5851\u81a0\u600e\u9ebc\u9078\uff1f\u672c\u6587\u6df1\u5ea6\u89e3\u6790 FR4\u3001CDM\u5408\u6210\u77f3\u3001PTFE\u3001PEEK\u3001PI \u8207 PBI \u516d\u5927\u8010\u9ad8\u4f4e\u6eab\u5851\u81a0\u6750\u6599\uff0c\u63d0\u4f9b\u9023\u7e8c\u8010\u6eab\uff08RTI\uff09\u3001\u77ed\u671f\u6975\u9650\u8207\u96f6\u4e0b\u4f4e\u6eab\u5de5\u4f5c\u5c0d\u7167\u8868\uff0c\u62c6\u89e3\u71b1\u8b8a\u5f62\u6eab\u5ea6\u8207\u6a5f\u68b0\u5f37\u5ea6\u53d6\u6368\u3002<\/p>","protected":false},"author":1,"featured_media":2371,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[45],"tags":[185,122,179],"class_list":["post-2370","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industrial-knowledge","tag-185","tag-122","tag-179"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/posts\/2370","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/comments?post=2370"}],"version-history":[{"count":2,"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/posts\/2370\/revisions"}],"predecessor-version":[{"id":3862,"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/posts\/2370\/revisions\/3862"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/media\/2371"}],"wp:attachment":[{"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/media?parent=2370"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/categories?post=2370"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.taichungbro.com\/en\/wp-json\/wp\/v2\/tags?post=2370"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}