Conclusion<\/a><\/li><\/ul><\/nav><\/div>\n\n\n\n
\n\n\n\nIn modern industry, the properties of material surfaces are often more critical than the materials themselves. Whether it's photoresist adhesion in semiconductor manufacturing or aseptic processing of medical devices, surface modification and sterilization technologies are core to improving product reliability. In recent years, low-temperature plasma has gradually replaced traditional chemical treatment methods due to its high activity, low energy consumption, and lack of chemical residue. Compared to plasma released by high-energy astronomical phenomena such as geomagnetic storms, industrial low-temperature plasma is generated under controllable conditions, allowing for precise adjustment of energy output and achieving modification or sterilization effects on specific materials. This article will delve into the physical principles and process parameters of low-temperature plasma, as well as its applications in industrial surface treatment and sterilization.<\/p>\n\n\n\n
The physical basis of low-temperature plasma<\/h2>\n\n\n\n
Plasma is an "ionized gas" composed of electrons, ions, neutral particles, and photons. When a gas is partially ionized under an applied electric field or a high-frequency electric field, it enters the plasma state. In low-temperature plasma, the overall gas temperature remains close to room temperature, but the free electrons possess extremely high energy, effectively triggering chemical reactions. This is why it is suitable for fragile materials such as polymers or biological tissues.<\/p>\n\n\n\n
In the theoretical model, the plasma ionization degree can be estimated using the Saha equation:<\/p>\n\n\n\n