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Tag: Packaging Simulation
Moldflow – 微晶片封裝模組操作概要
July 31, 2024
/
Chris
/
IC Package
,
MOLDFLOW
,
Packaging Simulation
,
Mold Flow Analysis
MOLDFLOW 是一款由 Autodesk 公司開發的塑膠射出模擬軟體,廣泛應用於塑料成型工業,是
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