Tag: PUE

There is no absolute superiority of immersion liquid cooling over plate liquid cooling. This article summarizes the selection criteria for existing data centers and high-density AI servers, considering factors such as heat transfer paths, data center renovation, maintenance, leakage, material compatibility, and single/dual-phase systems.

With technological advancements, the improved performance of electronic devices has led to significant demands for heat dissipation. TDP (Thermal Design Power) and PUE (Power Usage Effectiveness) are key metrics for measuring the thermal efficiency of equipment and data centers.