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Tag: chiplet
ABF載板
chiplet
IC Substrates
TGV
先進封裝
半導體封裝
玻璃基板
2026/07/02
/
Industrial Knowledge
玻璃基板是什麼?為什麼先進封裝開始關注它?
玻璃基板是先進封裝的新興載板材料,重點不只是透明,而是平坦度、尺寸穩定、細線路與高密度互連。本文從 ABF 載板限制、TGV 製程、chip
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By Cody X
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