Month: July 2025

Vacuum brazing is a process that uses a filler metal with a lower melting point than the base metal to perform "liquid phase diffusion bonding" in a high vacuum environment. Because the residual oxygen in the furnace is extremely low, oxygen is avoided...

By embedding pressure and temperature sensors directly into the injection mold, the actual PT curve of the melt in the mold cavity can be monitored simultaneously. Through closed-loop fine-tuning of holding pressure and cooling time, warpage and short-shot defects are significantly reduced, and yield can be improved.

Annealing is a crucial step in semiconductor manufacturing processes for activating doping and repairing defects. This article provides an in-depth comparison of temperature spikes, thermal budgets, and uniformity in furnace tube, RTA, LSA, and microwave annealing, and explains how...

Liquid metal has a thermal conductivity as high as 29 W/m·K and

Mass production of carbon fiber composites is no longer expensive and slow! This article compares the pressure, cycle time, porosity, and material cost of hot pressing and high-pressure RTM, and analyzes Kamal-Sourour...

Nanoimprint lithography directly replicates 10 nm-level patterns using imprinting, with equipment costs only 10% of EUV and energy consumption reduced by 90%. This article provides an in-depth comparison of resolution, throughput, and L1 resolution.