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Category: Industrial Knowledge

AI伺服器機櫃、GPU運算板、液冷管路與高速網路交換器組成的資料中心示意圖

Why are Wily and AI servers frequently trending on social media? What exactly is inside an AI server?

Wistron is often used to discuss AI servers and cloud data centers. This article breaks down the components of an AI server, including the GPU, CPU, memory, network, power supply, cooling, rack, and maintenance.
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DRAM晶圓、記憶體模組與資料中心伺服器組成的半導體產業示意圖

What does Nanya Technology do? Analysis of its main niche DRAM product line, DDR4/DDR5 process positioning, and industry indicators.

What does Nanya Technology (2408) do in the memory industry? A table summarizing Nanya Technology's product revenue structure in consumer, low-power, and automotive DRAM, its 10nm process progress, and how to assess DRA (Data Revenue Sharing).
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資料中心工程師檢查 AI 伺服器內的銅冷板、銅匯流排與冷卻管路,用來呈現銅在電力與散熱中的角色

Why is copper a key material for power, heat dissipation, and AI servers?

Copper is more than just a traditional electrical wire material. From power transmission, busbars, thermal conductivity, and liquid cooling plates to AI servers, copper is responsible for both sending electricity in and transmitting heat out. This article analyzes copper from the perspectives of material properties and engineering selection.
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資料中心內並列的浸沒式液冷槽與冷板液冷伺服器管路

Immersion liquid cooling vs. plate liquid cooling: Which to choose? A complete comparison of heat dissipation, maintenance, and retrofit costs.

There is no absolute superiority of immersion liquid cooling over plate liquid cooling. This article summarizes the selection criteria for existing data centers and high-density AI servers, considering factors such as heat transfer paths, data center renovation, maintenance, leakage, material compatibility, and single/dual-phase systems.
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無塵室工程師在檢查平台上觀察透明玻璃基板與多顆晶片封裝模組

What are the differences between glass substrates and ABF carriers? Analysis of the flatness and warpage challenges in the advanced packaging TGV process.

Why is advanced packaging shifting from ABF organic substrates to glass substrates? This article compares the coefficients of thermal expansion (CTE), flatness, and TGV glass via yield challenges of silicon interlayers, ABF, and glass substrates.
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無塵室工程師檢視矽晶圓,背景為不同世代的半導體生產設備

Where are advanced and mature process technologies used? A comprehensive guide from AI chips and automotive MCUs to power devices.

Advanced manufacturing processes do not necessarily outperform mature processes in every aspect. This article analyzes the performance, cost, and reliability of different nodes in AI chips, mobile processors, automotive MCUs, sensors, analog ICs, and power components.
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