Tag: IC Substrates

Why is advanced packaging shifting from ABF organic substrates to glass substrates? This article compares the coefficients of thermal expansion (CTE), flatness, and TGV glass via yield challenges of silicon interlayers, ABF, and glass substrates.

As the interface between semiconductor chips and printed circuit boards (PCBs), IC substrates are primarily responsible for electrical connections and mechanical support. With the shrinking size and increasing functionality of chips, the performance requirements for IC substrates are also becoming increasingly demanding.